Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles

出版年份 2009 全文链接

标题

Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles

作者

关键词

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出版物

JOURNAL OF ELECTRONIC MATERIALS

Volume 38, Issue 9, Pages 1866-1873

出版商

Springer Nature

发表日期

2009-05-22

DOI

10.1007/s11664-009-0840-1

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