Formation of Intermetallics in Sn-0.9Cu and Sn-0.7Cu-0.08Ni Solders - Peeref

标题

Formation of Intermetallics in Sn-0.9Cu and Sn-0.7Cu-0.08Ni Solders

作者

关键词

-

出版物

JOURNAL OF ELECTRONIC MATERIALS

Volume 40, Issue 6, Pages 1403-1408

出版商

Springer Nature

发表日期

2011-02-04

DOI

10.1007/s11664-010-1496-6

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