Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates

标题
Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates
作者
关键词
-
出版物
JOM
Volume 61, Issue 6, Pages 45-51
出版商
Springer Nature
发表日期
2009-06-09
DOI
10.1007/s11837-009-0087-6

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