Suppressing the growth of Cu–Sn intermetallic compounds in Ni/Sn–Ag–Cu/Cu–Zn solder joints during thermal aging

标题
Suppressing the growth of Cu–Sn intermetallic compounds in Ni/Sn–Ag–Cu/Cu–Zn solder joints during thermal aging
作者
关键词
-
出版物
INTERMETALLICS
Volume 26, Issue -, Pages 11-17
出版商
Elsevier BV
发表日期
2012-04-28
DOI
10.1016/j.intermet.2012.03.046

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