Heterogeneous nucleation of Cu 6 Sn 5 in Sn–Cu–Al solders

标题

作者

关键词

Intermetallics, Crystal growth, Microstructure, Electron backscatter diffraction (EBSD), Pb-free soldering, Solidification

出版物

Volume 619, Issue -, Pages 345-355

出版商

Elsevier BV

发表日期

2014-09-10

DOI

10.1016/j.jallcom.2014.08.251

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