Effects of indium addition on properties and wettability of Sn–0.7Cu–0.2Ni lead-free solders

出版年份 2014 全文链接

标题

Effects of indium addition on properties and wettability of Sn–0.7Cu–0.2Ni lead-free solders

作者

关键词

-

出版物

MATERIALS & DESIGN

Volume 64, Issue -, Pages 15-20

出版商

Elsevier BV

发表日期

2014-07-29

DOI

10.1016/j.matdes.2014.07.035

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