Differences in the interfacial reaction between Cu substrate and metastable supercooled liquid Sn–Cu solder or solid Sn–Cu solder at 222 °C: Experimental results versus theoretical model calculations
Differences in the interfacial reaction between Cu substrate and metastable supercooled liquid Sn–Cu solder or solid Sn–Cu solder at 222 °C: Experimental results versus theoretical model calculations
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