Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys

出版年份 2009 全文链接

标题

Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys

作者

关键词

-

出版物

INTERMETALLICS

Volume 18, Issue 1, Pages 145-149

出版商

Elsevier BV

发表日期

2009-08-04

DOI

10.1016/j.intermet.2009.07.005

向作者/读者发起求助以获取更多资源

Protocol

Reagent

Reprint

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now

© Peeref 2019-2024. All rights reserved.