Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint

出版年份 2017 全文链接

标题

作者

关键词

Metals and alloys, Intermetallics, Solid state reactions, Mechanical properties, Microstructure

出版物

Volume 728, Issue -, Pages 992-1001

出版商

Elsevier BV

发表日期

2017-09-04

DOI

10.1016/j.jallcom.2017.09.011

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