Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy

标题
Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy
作者
关键词
-
出版物
ADVANCES IN COLLOID AND INTERFACE SCIENCE
Volume 166, Issue 1-2, Pages 87-118
出版商
Elsevier BV
发表日期
2011-05-22
DOI
10.1016/j.cis.2011.05.005

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