Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

标题
Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design
作者
关键词
Pb-free solders, Sn–Cu, Aluminum alloying, Intermetallic compounds, Solidification
出版物
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 650, Issue -, Pages 106-115
出版商
Elsevier BV
发表日期
2015-08-05
DOI
10.1016/j.jallcom.2015.08.003

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