Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates

出版年份 2017 全文链接

标题

作者

关键词

Lead-free solder, Reflow soldering, Microstructure, Intermetallic, Interfacial reaction, Shear strength

出版物

Volume 242, Issue -, Pages 235-245

出版商

Elsevier BV

发表日期

2016-11-27

DOI

10.1016/j.jmatprotec.2016.11.031

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