Tensile properties and microstructural characterization of Sn–0.7Cu–0.4Co bulk solder alloy for electronics applications

标题
Tensile properties and microstructural characterization of Sn–0.7Cu–0.4Co bulk solder alloy for electronics applications
作者
关键词
-
出版物
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 457, Issue 1-2, Pages 97-105
出版商
Elsevier BV
发表日期
2007-04-12
DOI
10.1016/j.jallcom.2007.03.028

向作者/读者发起求助以获取更多资源

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now