Microstructure-property relations in as-atomized and as-extruded Sn-Cu (-Ag) solder alloys

出版年份 2016 全文链接

标题

作者

关键词

Impulse atomization, Microstructure, Solders, Hardness, Wettability

出版物

Volume 680, Issue -, Pages 259-267

出版商

Elsevier BV

发表日期

2016-04-17

DOI

10.1016/j.jallcom.2016.04.129

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