Effects of Ni addition on the interfacial reactions between Sn–Cu solders and Ni substrate

出版年份 2009 全文链接

标题

Effects of Ni addition on the interfacial reactions between Sn–Cu solders and Ni substrate

作者

关键词

-

出版物

INTERMETALLICS

Volume 18, Issue 4, Pages 616-622

出版商

Elsevier BV

发表日期

2009-11-16

DOI

10.1016/j.intermet.2009.10.018

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