Effects of Co addition in eutectic Sn–3.5Ag solder on shear strength and microstructural development

标题
Effects of Co addition in eutectic Sn–3.5Ag solder on shear strength and microstructural development
作者
关键词
-
出版物
MICROELECTRONIC ENGINEERING
Volume 85, Issue 7, Pages 1577-1583
出版商
Elsevier BV
发表日期
2008-03-16
DOI
10.1016/j.mee.2008.03.002

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