Microstructural and mechanical properties analysis of extruded Sn–0.7Cu solder alloy

出版年份 2015 全文链接

标题

作者

关键词

Rapid solidification, Atomization, Solder alloys, Microstructures, Mechanical properties

出版物

Volume 4, Issue 1, Pages 84-92

出版商

Elsevier BV

发表日期

2015-01-16

DOI

10.1016/j.jmrt.2014.12.005

联系作者

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