Effects of solidification kinetics on microstructure formation in binary Sn–Cu solder alloys

标题
Effects of solidification kinetics on microstructure formation in binary Sn–Cu solder alloys
作者
关键词
-
出版物
ACTA MATERIALIA
Volume 59, Issue 4, Pages 1651-1658
出版商
Elsevier BV
发表日期
2010-12-08
DOI
10.1016/j.actamat.2010.11.032

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