The influence of ageing on the stabilisation of interfacial (Cu,Ni) 6 (Sn,Zn) 5 and (Cu,Au,Ni) 6 Sn 5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints
The influence of ageing on the stabilisation of interfacial (Cu,Ni) 6 (Sn,Zn) 5 and (Cu,Au,Ni) 6 Sn 5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints
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