Effect of aluminum concentration on the microstructure and mechanical properties of Sn–Cu–Al solder alloy

标题
Effect of aluminum concentration on the microstructure and mechanical properties of Sn–Cu–Al solder alloy
作者
关键词
Solder alloy, Aluminum, Microstructure, Wettability, Mechanical properties
出版物
MICROELECTRONICS RELIABILITY
Volume 55, Issue 3-4, Pages 596-601
出版商
Elsevier BV
发表日期
2015-01-20
DOI
10.1016/j.microrel.2014.12.017

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