Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

标题
Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification
作者
关键词
Lead-free solder, Cu, 6, Sn, 5, fiber, Microstructure, Directional solidification, Tensile properties
出版物
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 625, Issue -, Pages 241-250
出版商
Elsevier BV
发表日期
2014-11-21
DOI
10.1016/j.jallcom.2014.10.205

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