Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling
Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling
Discover Peeref hubs
Discuss science. Find collaborators. Network.
Join a conversationBecome a Peeref-certified reviewer
The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.
Get Started