Effect of adding 0.5wt% ZnO nanoparticles, temperature and strain rate on tensile properties of Sn–5.0wt% Sb–0.5wt% Cu (SSC505) lead free solder alloy

出版年份 2016 全文链接

标题

作者

关键词

Lead-free solder, Sn–Sb–Cu alloy, Microstructure, Composite solder, Mechanical properties

出版物

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Volume 657, Issue -, Pages 104-114

出版商

Elsevier BV

发表日期

2016-01-28

DOI

10.1016/j.msea.2016.01.081

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