The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging

标题
The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging
作者
关键词
-
出版物
MICROELECTRONICS RELIABILITY
Volume 49, Issue 3, Pages 288-295
出版商
Elsevier BV
发表日期
2009-01-05
DOI
10.1016/j.microrel.2008.11.014

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