Evaluation of solder/substrate thermal conductance and wetting angle of Sn–0.7wt%Cu–(0–0.1wt%Ni) solder alloys

标题
Evaluation of solder/substrate thermal conductance and wetting angle of Sn–0.7wt%Cu–(0–0.1wt%Ni) solder alloys
作者
关键词
Sn–Cu solder alloy, Solidification, Wetting, Thermal behavior
出版物
MATERIALS LETTERS
Volume 142, Issue -, Pages 163-167
出版商
Elsevier BV
发表日期
2014-11-27
DOI
10.1016/j.matlet.2014.11.088

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