Interfacial microstructure and properties of Sn–0.7Cu–0.05Ni/Cu solder joint with rare earth Nd addition

标题
Interfacial microstructure and properties of Sn–0.7Cu–0.05Ni/Cu solder joint with rare earth Nd addition
作者
关键词
-
出版物
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 509, Issue 25, Pages 7152-7161
出版商
Elsevier BV
发表日期
2011-04-19
DOI
10.1016/j.jallcom.2011.04.037

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