The effect of He plasma treatment on properties of organosilicate glass low-k films
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Title
The effect of He plasma treatment on properties of organosilicate glass low-k films
Authors
Keywords
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Journal
JOURNAL OF APPLIED PHYSICS
Volume 109, Issue 4, Pages 043303-043303-11
Publisher
AIP Publishing
Online
2011-02-24
DOI
10.1063/1.3549733
References
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Related references
Note: Only part of the references are listed.- Interaction of vacuum ultraviolet light with a low-k organosilicate glass film in the presence of NH3
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- (2009) M. A. Goldman et al. JOURNAL OF APPLIED PHYSICS
- Plasma damage mechanisms for low-k porous SiOCH films due to radiation, radicals, and ions in the plasma etching process
- (2008) Saburo Uchida et al. JOURNAL OF APPLIED PHYSICS
- Optical Property Changes in Low-k Films upon Ultraviolet-Assisted Curing
- (2008) Salvador Eslava et al. JOURNAL OF THE ELECTROCHEMICAL SOCIETY
- Damage mechanism in low-dielectric (low-k) films during plasma processes
- (2008) Butsurin Jinnai et al. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
- Effect of pressure on efficiency of UV curing of CVD-derived low-k material at different wavelengths
- (2008) L. Prager et al. MICROELECTRONIC ENGINEERING
- Interactions of photoresist stripping plasmas with nanoporous organo-silicate ultra low dielectric constant dielectrics
- (2007) P. Lazzeri et al. THIN SOLID FILMS
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