Prediction of UV spectra and UV-radiation damage in actual plasma etching processes using on-wafer monitoring technique

Mechanism for low-etching resistance and surface roughness of ArF photoresist during plasma irradiation

(2009) Butsurin Jinnai et al.   JOURNAL OF APPLIED PHYSICS

Reduction effect of line edge roughness on time-dependent dielectric breakdown lifetime of Cu/low-k interconnects by using CF[sub 3]I etching

(2009) Eiichi Soda et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B

Synergistic effects of vacuum ultraviolet radiation, ion bombardment, and heating in 193nm photoresist roughening and degradation

(2008) D. Nest et al.   APPLIED PHYSICS LETTERS

Plasma damage mechanisms for low-k porous SiOCH films due to radiation, radicals, and ions in the plasma etching process

(2008) Saburo Uchida et al.   JOURNAL OF APPLIED PHYSICS

Damage-free surface treatment of carbon nanotubes and self-assembled monolayer devices using a neutral beam process for fusing top–down and bottom–up processes

(2008) Seiji Samukawa et al.   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Damage mechanism in low-dielectric (low-k) films during plasma processes

(2008) Butsurin Jinnai et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B