Improvement of Uniformity and Reliability of Scaled-Down Cu Interconnects with Carbon-Rich Low-kFilms

Published 2011 View Full Article

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Title
Improvement of Uniformity and Reliability of Scaled-Down Cu Interconnects with Carbon-Rich Low-kFilms
Authors
Keywords
-
Journal
JAPANESE JOURNAL OF APPLIED PHYSICS
Volume 50, Issue 4, Pages 04DB02
Publisher
Japan Society of Applied Physics
Online
2011-04-26
DOI
10.1143/jjap.50.04db02

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