Damage by radicals and photons during plasma cleaning of porous low-k SiOCH. II. Water uptake and change in dielectric constant

Damage by radicals and photons during plasma cleaning of porous low-k SiOCH. I. Ar/O2 and He/H2 plasmas

(2012) Juline Shoeb et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Mechanisms for sealing of porous low-k SiOCH by combined He and NH3 plasma treatment

(2011) Juline Shoeb et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Prediction of UV spectra and UV-radiation damage in actual plasma etching processes using on-wafer monitoring technique

(2010) Butsurin Jinnai et al.   JOURNAL OF APPLIED PHYSICS

The mechanism of low-k SiOCH film modification by oxygen atoms

(2010) O. V. Braginsky et al.   JOURNAL OF APPLIED PHYSICS

Synergistic damage effects of vacuum ultraviolet photons and O2in SiCOH ultra-low-kdielectric films

(2010) J Lee et al.   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Effects of He Plasma Pretreatment on Low-k Damage during Cu Surface Cleaning with NH[sub 3] Plasma

(2010) A. M. Urbanowicz et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Fundamental mechanisms of oxygen plasma-induced damage of ultralow-k organosilicate materials: The role of thermal P3 atomic oxygen

(2009) Mrunalkumar Chaudhari et al.   APPLIED PHYSICS LETTERS

Hybrid modelling of low temperature plasmas for fundamental investigations and equipment design

(2009) Mark J Kushner   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Plasma atomic layer etching using conventional plasma equipment

(2009) Ankur Agarwal et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Origin of dielectric loss induced by oxygen plasma on organo-silicate glass low-k dielectrics

(2008) H. Shi et al.   APPLIED PHYSICS LETTERS

Plasma damage mechanisms for low-k porous SiOCH films due to radiation, radicals, and ions in the plasma etching process

(2008) Saburo Uchida et al.   JOURNAL OF APPLIED PHYSICS