Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere
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Title
Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere
Authors
Keywords
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Journal
Materials
Volume 16, Issue 6, Pages 2389
Publisher
MDPI AG
Online
2023-03-17
DOI
10.3390/ma16062389
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