Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

Title
Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process
Authors
Keywords
-
Journal
ACTA MATERIALIA
Volume 59, Issue 3, Pages 1198-1211
Publisher
Elsevier BV
Online
2010-11-20
DOI
10.1016/j.actamat.2010.10.053

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