Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging

Published 2016 View Full Article

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Title
Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging
Authors
Keywords
Sintering, Surface modification, Copper, Oxides, Oxidation-reduction bonding
Journal
SCRIPTA MATERIALIA
Volume 120, Issue -, Pages 80-84
Publisher
Elsevier BV
Online
2016-04-28
DOI
10.1016/j.scriptamat.2016.04.018

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