Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation–Reduction Bonding with Copper Microparticles

In Situ Study of Reduction Process of CuO Paste and Its Effect on Bondability of Cu-to-Cu Joints

(2018) Takafumi Yao et al.   JOURNAL OF ELECTRONIC MATERIALS

Influence of Cu micro/nano-particles mixture and surface roughness on the shear strength of Cu-Cu joints

(2018) Yang Zuo et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Improvement of oxidation resistance and bonding strength of Cu nanoparticles solder joints of Cu–Cu bonding by phosphating the nanoparticle

(2018) Yang Zuo et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Novel transient liquid phase bonding through capillary action for high-temperature power devices packaging

(2018) Huakai Shao et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Bonding technology based on solid porous Ag for large area chips

(2018) Chuantong Chen et al.   SCRIPTA MATERIALIA

Effects of Phenolic Resin Addition on the Electrical Conductivity and Mechanical Strength of Nano-Copper Paste Formed Cu-Cu Joints

(2017) Runhua Gao et al.   JOURNAL OF ELECTRONIC MATERIALS

Thermal stability of low-temperature sintered joint using Sn-coated Cu particles during isothermal aging at 250 °C

(2017) Xiangdong Liu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Pressureless sintering bonding using hybrid microscale Cu particle paste on ENIG, pure Cu and pre-oxidized Cu substrate by an oxidation–reduction process

(2016) Xiangdong Liu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging

(2016) Xiangdong Liu et al.   SCRIPTA MATERIALIA

Survey of High-Temperature Reliability of Power Electronics Packaging Components

(2015) R. Khazaka et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Microscale Ag particle paste for sintered joints in high-power devices

(2015) Hiroshi Nishikawa et al.   MATERIALS LETTERS

A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding

(2015) Kunmo Chu et al.   SCRIPTA MATERIALIA

Rapid Sintering Nanosilver Joint by Pulse Current for Power Electronics Packaging

(2013) Yunhui Mei et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste

(2013) Tomohiro Yamakawa et al.   JOURNAL OF ELECTRONIC MATERIALS

Effects of Solvents in the Polyethylene Glycol Series on the Bonding of Copper Joints Using Ag2O Paste

(2012) Shinya Takata et al.   JOURNAL OF ELECTRONIC MATERIALS

The effect of reduction atmospheres on the sintering behaviors of inkjet-printed Cu interconnectors

(2010) Inyoung Kim et al.   JOURNAL OF APPLIED PHYSICS

A Low-Temperature Bonding Process Using Mixed Cu–Ag Nanoparticles

(2010) Y. Morisada et al.   JOURNAL OF ELECTRONIC MATERIALS

High-temperature lead-free solder alternatives

(2010) Vivek Chidambaram et al.   MICROELECTRONIC ENGINEERING