Microstructural and mechanical characteristics of Cu-Sn intermetallic compound interconnects formed by TLPB with Cu-Sn nanocomposite

Extremely thin interlayer of multi-element intermetallic compound between Sn-based solders and FeCoNiMn high-entropy alloy

(2021) Yu-An Shen et al.   APPLIED SURFACE SCIENCE

Hybrid transient liquid phase sintering bonding of Sn-3.0Ag-0.5Cu solder with added Cu and Ni for Cu Ni bonding

(2021) Kyung Deuk Min et al.   APPLIED SURFACE SCIENCE

Rapid formation of intermetallic joint using Cu-Sn nanocomposite interlayer based on patterned copper nanowire array

(2021) Han Jiang et al.   MATERIALS LETTERS

Interfacial Reactions between Ga and Cu-10Ni Substrate at Low Temperature

(2020) Shiqian Liu et al.   ACS Applied Materials & Interfaces

Experimental and computational investigation of low temperature Cu Sn solid-state-diffusion bonding for 3D integration

(2020) Jian Cai et al.   MICROELECTRONIC ENGINEERING

A review: Formation of voids in solder joint during the transient liquid phase bonding process - Causes and solutions

(2019) Omid Mokhtari   MICROELECTRONICS RELIABILITY

Novel transient liquid phase bonding through capillary action for high-temperature power devices packaging

(2018) Huakai Shao et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation

(2018) P. Wild et al.   MICROELECTRONICS RELIABILITY

The nucleation-controlled intermetallic grain refinement of Cu-Sn solid-liquid interdiffusion wafer bonding joints induced by addition of Ni particles

(2018) Z.L. Li et al.   SCRIPTA MATERIALIA

Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects – A novel approach for hybrid metal baseplates

(2018) M. Brincker et al.   MICROELECTRONICS RELIABILITY

Nanomaterials in Skin-Inspired Electronics: Toward Soft and Robust Skin-like Electronic Nanosystems

(2018) Donghee Son et al.   ACS Nano

Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology

(2018) K.N. Tu et al.   MATERIALS SCIENCE & ENGINEERING R-REPORTS

Cu@Sn Core–Shell Structure Powder Preform for High-Temperature Applications Based on Transient Liquid Phase Bonding

(2017) Hongtao Chen et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Grain morphology and mechanical strength of high-melting-temperature intermetallic joints formed in asymmetrical Ni/Sn/Cu system using transient liquid phase soldering process

(2017) H.J. Dong et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach

(2017) Xiangdong Liu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene

(2016) Yong-Ho Ko et al.   ACS Applied Materials & Interfaces

Full intermetallic joints for chip stacking by using thermal gradient bonding

(2016) T.L. Yang et al.   ACTA MATERIALIA

Enhanced shear strength of Cu–Sn intermetallic interconnects with interlocking dendrites under fluxless electric current-assisted bonding process

(2016) Baolei Liu et al.   JOURNAL OF MATERIALS SCIENCE

Formation of plate-like channels in Cu 6 Sn 5 and Cu 3 Sn intermetallic compounds during transient liquid reaction of Cu/Sn/Cu structures

(2016) Wei-Lan Chiu et al.   MATERIALS LETTERS

Thermally stable Cu 3 Sn/Cu composite joint for high-temperature power device

(2016) Xiangdong Liu et al.   SCRIPTA MATERIALIA

Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application

(2016) Hongjun Ji et al.   SCRIPTA MATERIALIA

Die attach materials with high remelting temperatures created by bonding Cu@Sn microparticles at lower temperatures

(2016) Tianqi Hu et al.   MATERIALS & DESIGN

Microstructural and mechanical analysis on Cu–Sn intermetallic micro-joints under isothermal condition

(2015) L. Mo et al.   INTERMETALLICS

Optimal Ag addition for the elimination of voids in Ni/SnAg/Ni micro joints for 3D IC applications

(2015) J.J. Yu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Solid-state reaction of electroplated thin film Au/Sn couple at low temperatures

(2015) H. Xu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of Process and Service Conditions on TLP-Bonded Components with (Ag,Ni–)Sn Interlayer Combinations

(2015) Adrian Lis et al.   JOURNAL OF ELECTRONIC MATERIALS

Rapid formation of Cu/Cu3Sn/Cu joints using ultrasonic bonding process at ambient temperature

(2013) Mingyu Li et al.   APPLIED PHYSICS LETTERS

Formation mechanism and orientation of Cu3Sn grains in Cu–Sn intermetallic compound joints

(2013) Rui Zhang et al.   MATERIALS LETTERS

Critical Concerns in Soldering Reactions Arising from Space Confinement in 3-D IC Packages

(2012) H. Y. Chuang et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures

(2012) B. Dimcic et al.   MICROELECTRONICS RELIABILITY

Concurrent nucleation, formation and growth of two intermetallic compounds (Cu6Sn5 and Cu3Sn) during the early stages of lead-free soldering

(2011) M.S. Park et al.   ACTA MATERIALIA

Mechanical properties of nano-silver joints as die attach materials

(2011) Kim S. Siow   JOURNAL OF ALLOYS AND COMPOUNDS

Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

(2010) J.F. Li et al.   ACTA MATERIALIA

A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module

(2010) Puqi Ning et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate

(2008) Jicheng Gong et al.   ACTA MATERIALIA

High-temperature creep and hardness of eutectic 80Au/20Sn solder

(2007) Y.C. Liu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

The growth and roughness evolution of intermetallic compounds of Sn–Ag–Cu/Cu interface during soldering reaction

(2007) D.Q. Yu et al.   JOURNAL OF ALLOYS AND COMPOUNDS