Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere

In-situ observation of fluxless soldering of Sn-3.0Ag-0.5Cu/Cu under a formic acid atmosphere

(2019) Siliang He et al.   MATERIALS CHEMISTRY AND PHYSICS

Wetting of Sn/Cu and Sn/Cu-Sn IMCs at 623–723K

(2018) Qiaoli Lin et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Characterization of soldering alloy type Zn-In-Mg and the study of direct soldering of silicon and copper

(2018) Roman Koleňák et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn–Ag–Cu solder

(2018) Hyunju Lee et al.   MICROELECTRONICS RELIABILITY

Residual free solder process for fluxless solder pastes

(2018) Alexander Hanss et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

(2018) Roman Koleňák et al.   Metals

Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps

(2018) Yu-An Shen et al.   MATERIALS LETTERS

A review of lead-free solders for electronics applications

(2017) Shunfeng Cheng et al.   MICROELECTRONICS RELIABILITY

Wetting and spreading kinetics of liquid Sn on Ag and Ag 3 Sn substrates

(2017) O.Y. Liashenko et al.   SCRIPTA MATERIALIA

Effect of Sn grain orientation on formation of Cu 6 Sn 5 intermetallic compounds during electromigration

(2017) Yu-An Shen et al.   SCRIPTA MATERIALIA

Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis

(2016) K. Dušek et al.   MICROELECTRONICS RELIABILITY

Flux effect on void quantity and size in soldered joints

(2016) D. Bušek et al.   MICROELECTRONICS RELIABILITY

Thermogravimetric investigation on the interaction of formic acid with solder joint materials

(2016) Fosca Conti et al.   NEW JOURNAL OF CHEMISTRY

Impact strength of Sn–3.0Ag–0.5Cu solder bumps during isothermal aging

(2014) JianXin Wang et al.   MICROELECTRONICS RELIABILITY

A review: On the development of low melting temperature Pb-free solders

(2014) Hiren R. Kotadia et al.   MICROELECTRONICS RELIABILITY

Effects of third element and surface finish on interfacial reactions of Sn–Ag–xCu (or Ni)/(Cu or ENIG) solder joints

(2010) Jeong-Won Yoon et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of oxide thickness of solder powders on the coalescence of SnAgCu lead-free solder pastes

(2009) Shasha Zhang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders

(2009) N. Zhao et al.   JOURNAL OF ELECTRONIC MATERIALS

Generation of Tin(II) Oxide Crystals on Lead-Free Solder Joints in Deionized Water

(2009) Hong Chang et al.   JOURNAL OF ELECTRONIC MATERIALS

Wetting in Soldering and Microelectronics

(2008) T. Matsumoto et al.   Annual Review of Materials Research

A Comparative Study of Reactive Wetting of Lead and Lead-Free Solders on Cu and (Cu6Sn5/Cu3Sn)/Cu Substrates

(2008) Hongqin Wang et al.   JOURNAL OF ELECTRONIC MATERIALS