Interfacial reaction, shear behavior and microhardness of Cu-Sn TLP bonding joints bearing CuZnAl powder for 3D packaging

Diversifying grain orientation and expediting 10 μm Cu/Sn/Cu TLP bonding process with Ni doping

(2021) Yu-Ching Wang et al.   Journal of Materials Science: Materials in Electronics

Effect of microstructure aspects on mechanical properties of nanoparticle-assisted transient liquid phase (NP-TLP) joints for AZ31 alloy

(2021) F. Dehnavi et al.   Journal of Manufacturing Processes

Four Dimensional (4D) Microstructural Evolution of Cu6Sn5 Intermetallic and Voids under Electromigration in Bi-crystal Pure Sn Solder Joints

(2020) Marion Branch Kelly et al.   ACTA MATERIALIA

Inhibition of intermetallic compounds growth at Sn–58Bi/Cu interface bearing CuZnAl memory particles (2–6 μm)

(2020) Liang Zhang et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Fast formation of Cu-Sn intermetallic joints using pre-annealed Sn/Cu/Sn composite preform for high-temperature bonding applications

(2020) So-Eun Jeong et al.   THIN SOLID FILMS

Microstructure evolution and mechanical properties of ultrasonically TLP bonded Mg joint

(2020) Zhiwu Xu et al.   Journal of Manufacturing Processes

Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review

(2020) Mu-lan Li et al.   MATERIALS & DESIGN

Effect of CuZnAl particles addition on microstructure of Cu/Sn58Bi/Cu TLP bonding solder joints

(2019) Mingyue Xiong et al.   VACUUM

Tensile deformation and microstructures of Sn–3.0Ag–0.5Cu solder joints: Effect of annealing temperature

(2019) Wenbin Tang et al.   MICROELECTRONICS RELIABILITY

Effect of addition of CuZnAl particle on the properties of Sn solder joint

(2019) Lei Sun et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multiple reflows

(2018) H.R. Ma et al.   INTERMETALLICS

Pronounced effects of Zn additions on Cu-Sn microjoints for chip-stacking applications

(2018) Y.W. Wang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

A study of Ni 3 Sn 4 growth dynamics in Ni-Sn TLPS bonding process by differential scanning calorimetry

(2018) Hongliang Feng et al.   THERMOCHIMICA ACTA

Effect of stress triaxiality on damage evolution of porous solder joints in IGBT Discretes

(2018) Majid Samavatian et al.   Journal of Manufacturing Processes

Mechanical behaviour of sintered silver nanoparticles reinforced by SiC microparticles

(2018) Xu Long et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Influence of Ni particle addition on grain refinement of Cu-Sn intermetallic compound joints bonded at various temperatures

(2018) X.J. Guo et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology

(2018) K.N. Tu et al.   MATERIALS SCIENCE & ENGINEERING R-REPORTS

Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study

(2015) Soud Farhan Choudhury et al.   JOURNAL OF ELECTRONIC PACKAGING

Effects of silver addition on Cu–Sn microjoints for chip-stacking applications

(2014) T.L. Yang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction

(2013) L. M. Yang et al.   JOURNAL OF ELECTRONIC MATERIALS

Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects

(2013) Iuliana Panchenko et al.   MICROELECTRONIC ENGINEERING

The Cu–Sn phase diagram, Part I: New experimental results

(2012) S. Fürtauer et al.   INTERMETALLICS

Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates

(2008) Y.W. Wang et al.   MICROELECTRONICS RELIABILITY