Effects of antimony on the microstructure, thermal properties, mechanical performance, and interfacial behavior of Sn–0.7Cu–0.05Ni–xSb/Cu solder joints
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Title
Effects of antimony on the microstructure, thermal properties, mechanical performance, and interfacial behavior of Sn–0.7Cu–0.05Ni–xSb/Cu solder joints
Authors
Keywords
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Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 32, Issue 23, Pages 27607-27624
Publisher
Springer Science and Business Media LLC
Online
2021-10-06
DOI
10.1007/s10854-021-07135-3
References
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