Large-area and low-cost Cu–Cu bonding with cold spray deposition, oxidation, and reduction processes under low-temperature conditions
Published 2021 View Full Article
- Home
- Publications
- Publication Search
- Publication Details
Title
Large-area and low-cost Cu–Cu bonding with cold spray deposition, oxidation, and reduction processes under low-temperature conditions
Authors
Keywords
-
Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 32, Issue 15, Pages 20461-20473
Publisher
Springer Science and Business Media LLC
Online
2021-07-20
DOI
10.1007/s10854-021-06556-4
References
Ask authors/readers for more resources
Related references
Note: Only part of the references are listed.- Cu-Cu joining using citrate coated ultra-small nano-silver pastes
- (2021) Shuye Zhang et al. Journal of Manufacturing Processes
- Pressure-assisted sinter bonding method at 300 °C in air using a resin-free paste containing 1.5 μm Cu@Ag particles
- (2021) Eun Byeol Choi et al. APPLIED SURFACE SCIENCE
- Cu to Cu direct bonding at low temperature with high density defect in electrodeposited Cu
- (2021) Haneul Han et al. APPLIED SURFACE SCIENCE
- High bond strength Cu joints fabricated by rapid and pressureless in situ reduction-sintering of Cu nanoparticles
- (2020) Yang Zuo et al. MATERIALS LETTERS
- Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation–Reduction Bonding with Copper Microparticles
- (2019) Runhua Gao et al. JOURNAL OF ELECTRONIC MATERIALS
- Thermal-stable void-free interface morphology and bonding mechanism of low-temperature Cu-Cu bonding using Ag nanostructure as intermediate
- (2018) Ziyu Liu et al. JOURNAL OF ALLOYS AND COMPOUNDS
- In Situ Study of Reduction Process of CuO Paste and Its Effect on Bondability of Cu-to-Cu Joints
- (2018) Takafumi Yao et al. JOURNAL OF ELECTRONIC MATERIALS
- Influence of Cu micro/nano-particles mixture and surface roughness on the shear strength of Cu-Cu joints
- (2018) Yang Zuo et al. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
- Characterizations and anisotropy of cold-spraying additive-manufactured copper bulk
- (2018) Kang Yang et al. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
- Novel Method of Aluminum to Copper Bonding by Cold Spray
- (2018) Si-Lin Fu et al. JOURNAL OF THERMAL SPRAY TECHNOLOGY
- Cu-Cu bonding enhancement at low temperature by using carboxylic acid surface-modified Cu nanoparticles
- (2018) Yun Mou et al. MATERIALS LETTERS
- Design of Cu nanoaggregates composed of ultra-small Cu nanoparticles for Cu-Cu thermocompression bonding
- (2018) Junjie Li et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere
- (2018) Yue Gao et al. MATERIALS & DESIGN
- Supersonic cold spraying of titania nanoparticles on reduced graphene oxide for lithium ion battery anodes
- (2017) Edmund Samuel et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Effects of impact conditions on the electrical and mechanical properties of supersonic cold sprayed Cu–Ni electrodes
- (2017) Jong-Gun Lee et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Demonstration of sub 150 °C Cu-Cu thermocompression bonding for 3D IC applications, utilizing an ultra-thin layer of Manganin alloy as an effective surface passivation layer
- (2017) Asisa Kumar Panigrahi et al. MATERIALS LETTERS
- Microstructure evolution and thermostability of bondline based on Cu@Sn core-shell structured microparticles under high-temperature conditions
- (2017) Tianqi Hu et al. MATERIALS & DESIGN
- Dry-growth of silver single-crystal nanowires from porous Ag structure
- (2016) Chuantong Chen et al. APPLIED PHYSICS LETTERS
- Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging
- (2016) Xiangdong Liu et al. SCRIPTA MATERIALIA
- Interface behavior of particles upon impacting during cold spraying of Cu/Ni/Al mixture
- (2016) Wenya Li et al. MATERIALS & DESIGN
- Nickel–copper hybrid electrodes self-adhered onto a silicon wafer by supersonic cold-spray
- (2015) Jong-Gun Lee et al. ACTA MATERIALIA
- Ultrathin CuO nanowires grown by thermal oxidation of copper powders in air
- (2015) Qing Yang et al. MATERIALS LETTERS
- Recent advances on dielectrics technology for SiC and GaN power devices
- (2014) F. Roccaforte et al. APPLIED SURFACE SCIENCE
- High velocity impact induced microstructure evolution during deposition of cold spray coatings: A review
- (2014) Xiao-Tao Luo et al. SURFACE & COATINGS TECHNOLOGY
- Effect of Polyethylene Glycols with Different Polymer Chain Lengths on the Bonding Process Involving In Situ Formation of Silver Nanoparticles from Ag2O
- (2013) Tomohiro Yagishita et al. MATERIALS TRANSACTIONS
- A new one-pot method for the synthesis of Cu nanoparticles for low temperature bonding
- (2012) Toshitaka Ishizaki et al. JOURNAL OF MATERIALS CHEMISTRY
- High Pressure Cold Sprayed (HPCS) and Low Pressure Cold Sprayed (LPCS) Coatings Prepared from OFHC Cu Feedstock: Overview from Powder Characteristics to Coating Properties
- (2012) Heli Koivuluoto et al. JOURNAL OF THERMAL SPRAY TECHNOLOGY
- Preparation and Low-Temperature Sintering of Cu Nanoparticles for High-Power Devices
- (2012) Shutesh Krishnan et al. IEEE Transactions on Components Packaging and Manufacturing Technology
- Characterization of Ti cold spray coatings by indentation methods
- (2011) Jihane Ajaja et al. ACTA ASTRONAUTICA
- CuO nanowires synthesized by thermal oxidation route
- (2007) J.T. Chen et al. JOURNAL OF ALLOYS AND COMPOUNDS
Publish scientific posters with Peeref
Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.
Learn MoreAdd your recorded webinar
Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.
Upload Now