Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere
出版年份 2023 全文链接
标题
Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere
作者
关键词
-
出版物
Materials
Volume 16, Issue 6, Pages 2389
出版商
MDPI AG
发表日期
2023-03-17
DOI
10.3390/ma16062389
参考文献
相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。- Effects of cobalt nanoparticle on microstructure of Sn58Bi solder joint
- (2023) Muhammad Nasir Bashir et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Thermomigration suppression in Sn3.5Ag solder joints by hot-end FeCoNiMn alloy
- (2023) Yu-An Shen et al. INTERMETALLICS
- Investigation of Cu-Sn-Cu transient liquid phase bonding for microsystems packaging
- (2022) Karan Pawar et al. MATERIALS AND MANUFACTURING PROCESSES
- Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint
- (2022) M. Nasir Bashir et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Effect of cobalt nanoparticles on mechanical properties of Sn–58Bi solder joint
- (2022) M. Nasir Bashir et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere
- (2022) Siliang He et al. Journal of Materials Research and Technology-JMR&T
- Effect of bonding temperature and bonding time on microstructure of dissimilar transient liquid phase bonding of GTD111/BNi-2/IN718 system
- (2022) Ali Izadi Ghahferokhi et al. Journal of Materials Research and Technology-JMR&T
- Microstructural and mechanical characteristics of Cu-Sn intermetallic compound interconnects formed by TLPB with Cu-Sn nanocomposite
- (2022) Han Jiang et al. Materials Today Communications
- Advancements in energy efficientGaNpower devices and power modules for electric vehicle applications: a review
- (2021) Ravindranath Tagore Yadlapalli et al. INTERNATIONAL JOURNAL OF ENERGY RESEARCH
- Low-Temperature Co-hydroxylated Cu/SiO2 Hybrid Bonding Strategy for a Memory-Centric Chip Architecture
- (2021) Qiushi Kang et al. ACS Applied Materials & Interfaces
- Quasi-in-situ observation on diffusion anisotropy dominated asymmetrical growth of Cu-Sn IMCs under temperature gradient
- (2021) Yuanyuan Qiao et al. ACTA MATERIALIA
- Extremely thin interlayer of multi-element intermetallic compound between Sn-based solders and FeCoNiMn high-entropy alloy
- (2021) Yu-An Shen et al. APPLIED SURFACE SCIENCE
- Intermediate enrichment effect of porous Cu catalyst for CO2 electroreduction to C2 fuels
- (2021) Bao Liu et al. ELECTROCHIMICA ACTA
- Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints
- (2021) Tiam Foo Chen et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Large-area and low-cost Cu–Cu bonding with cold spray deposition, oxidation, and reduction processes under low-temperature conditions
- (2021) Juncai Hou et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Interfacial reaction, shear behavior and microhardness of Cu-Sn TLP bonding joints bearing CuZnAl powder for 3D packaging
- (2021) Lei Sun et al. Journal of Manufacturing Processes
- Improvement on the mechanical properties of eutectic Sn58Bi alloy with porous Cu addition during isothermal aging
- (2021) Yang Liu et al. Materials Research Express
- Effects of antimony on the microstructure, thermal properties, mechanical performance, and interfacial behavior of Sn–0.7Cu–0.05Ni–xSb/Cu solder joints
- (2021) Suchart Chantaramanee et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding
- (2020) Runhua Gao et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys
- (2020) Jeverton Laureano Paixão et al. MATERIALS CHARACTERIZATION
- Formic Acid: A Hydrogen-Bonding Cocatalyst for Formate Decomposition
- (2020) Benjamin W. J. Chen et al. ACS Catalysis
- Microstructural Analysis and Tribological Behavior of AMDRY 1371 (Mo–NiCrFeBSiC) Atmospheric Plasma Spray Deposited Thin Coatings
- (2020) Cornelia Cîrlan Paleu et al. Coatings
- Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation–Reduction Bonding with Copper Microparticles
- (2019) Runhua Gao et al. JOURNAL OF ELECTRONIC MATERIALS
- Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere
- (2019) Siliang He et al. JOURNAL OF MATERIALS SCIENCE
- Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size
- (2018) Chuantong Chen et al. MATERIALS & DESIGN
- Highly Conductive Cu–Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles
- (2016) Jingdong Liu et al. ACS Applied Materials & Interfaces
- Transient liquid phase bonding of Sn–Bi solder with added Cu particles
- (2016) Omid Mokhtari et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Interfacial reaction and mechanical properties for Cu/Sn/Ag system low temperature transient liquid phase bonding
- (2016) Huakai Shao et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging
- (2016) Xiangdong Liu et al. SCRIPTA MATERIALIA
- Effect of Process and Service Conditions on TLP-Bonded Components with (Ag,Ni–)Sn Interlayer Combinations
- (2015) Adrian Lis et al. JOURNAL OF ELECTRONIC MATERIALS
- Effect of Sb content on properties of Sn—Bi solders
- (2014) Cheng ZHANG et al. TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA
- Electronic Structures of Formic Acid (HCOOH) and Formate (HCOO–) in Aqueous Solutions
- (2012) Matthew A. Brown et al. Journal of Physical Chemistry Letters
- Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process
- (2010) J.F. Li et al. ACTA MATERIALIA
- Semiconducting polymers: the Third Generation
- (2010) Alan J. Heeger CHEMICAL SOCIETY REVIEWS
- Interfacial intermetallic growth and shear strength of lead-free composite solder joints
- (2008) S.M.L. Nai et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Sn–Co alloy anode using porous Cu as current collector for lithium ion battery
- (2008) Xiao-Yong Fan et al. JOURNAL OF ALLOYS AND COMPOUNDS
Become a Peeref-certified reviewer
The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.
Get StartedAsk a Question. Answer a Question.
Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.
Get Started