Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding
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Title
Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding
Authors
Keywords
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Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume -, Issue -, Pages -
Publisher
Springer Science and Business Media LLC
Online
2020-08-01
DOI
10.1007/s10854-020-04026-x
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