Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints
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Title
Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints
Authors
Keywords
Nanocrystalline materials, Grains and interfaces, Powder methods, Sintered silver, Lead-free, Die-attach materials
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 866, Issue -, Pages 158783
Publisher
Elsevier BV
Online
2021-02-03
DOI
10.1016/j.jallcom.2021.158783
References
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Note: Only part of the references are listed.- Fabrication of Nanoporous Cu Sheet and Application to Bonding for High-Temperature Applications
- (2020) Shunichi Koga et al. JOURNAL OF ELECTRONIC MATERIALS
- Influence of Aging Atmosphere on the Thermal Stability of Low-Temperature Rapidly Sintered Cu Nanoparticle Paste Joint
- (2020) Jiacheng Xie et al. JOURNAL OF ELECTRONIC MATERIALS
- Fabrication of high-strength Cu–Cu joint by low-temperature sintering micron–nano Cu composite paste
- (2020) Yang Peng et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Die-attach bonding for high temperature applications using thermal decomposition of copper(II) formate with polyethylene glycol
- (2020) Sri Krishna Bhogaraju et al. SCRIPTA MATERIALIA
- High bond strength Cu joints fabricated by rapid and pressureless in situ reduction-sintering of Cu nanoparticles
- (2020) Yang Zuo et al. MATERIALS LETTERS
- Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging
- (2020) Sri Krishna Bhogaraju et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Ambient Aqueous-Phase Synthesis of Copper Nanoparticles and Nanopastes with Low-Temperature Sintering and Ultra-High Bonding Abilities
- (2019) Yoichi Kamikoriyama et al. Scientific Reports
- Novel Cu-Ag Composite Nanoparticle Paste for Low Temperature Bonding
- (2019) Jiaxin Liu et al. MATERIALS LETTERS
- Influence of sintering environment on silver sintered on copper substrate
- (2019) K. S. Siow et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation–Reduction Bonding with Copper Microparticles
- (2019) Runhua Gao et al. JOURNAL OF ELECTRONIC MATERIALS
- Characterization of the die-attach process via low-temperature reduction of Cu formate in air
- (2019) Woo Lim Choi et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- SiC chip attachment sintered by nanosilver paste and their shear strength evaluation
- (2019) Hongqiang Zhang et al. Welding in the World
- Oxide-Free Copper Pastes for the Attachment of Large-Area Power Devices
- (2019) Luca Del Carro et al. JOURNAL OF ELECTRONIC MATERIALS
- Necking growth and mechanical properties of sintered Ag particles with different shapes under air and N2 atmosphere
- (2019) Chuantong Chen et al. JOURNAL OF MATERIALS SCIENCE
- High-temperature stability of copper nanoparticles through Cu@Ag nanostructures
- (2019) Thomas Michaud et al. JOURNAL OF NANOPARTICLE RESEARCH
- Thermal Ageing Studies of Sintered Micron-Silver (Ag) Joint as a Lead-Free Bonding Material
- (2019) K. S. Siow et al. METALS AND MATERIALS INTERNATIONAL
- Micron-sized Ag flake particles direct die bonding on electroless Ni–P-finished DBC substrate: low-temperature pressure-free sintering, bonding mechanism and high-temperature aging reliability
- (2019) Chuantong Chen et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Preparation of copper nanoparticles for metal-metal bonding by aqueous reduction with d-glucose and PVP
- (2019) Giuseppe Granata et al. CHEMICAL ENGINEERING SCIENCE
- Low temperature de-oxidation for copper surface by catalyzed formic acid vapor
- (2018) Pei-Wen Chou et al. APPLIED SURFACE SCIENCE
- Technological aspects of silver particle sintering for electronic packaging
- (2018) Jan Felba CIRCUIT WORLD
- In Situ Study of Reduction Process of CuO Paste and Its Effect on Bondability of Cu-to-Cu Joints
- (2018) Takafumi Yao et al. JOURNAL OF ELECTRONIC MATERIALS
- Influence of Cu micro/nano-particles mixture and surface roughness on the shear strength of Cu-Cu joints
- (2018) Yang Zuo et al. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
- Improvement of oxidation resistance and bonding strength of Cu nanoparticles solder joints of Cu–Cu bonding by phosphating the nanoparticle
- (2018) Yang Zuo et al. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
- High-temperature reliability of low-temperature and pressureless micron Ag sintered joints for die attachment in high-power device
- (2018) Hao Zhang et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Fabrication of reliable Cu-Cu joints by low temperature bonding isopropanol stabilized Cu nanoparticles in air
- (2018) Yun Mou et al. MATERIALS LETTERS
- How to determine surface roughness of copper substrate for robust pressureless sintered silver in air
- (2018) Meiyu Wang et al. MATERIALS LETTERS
- Ultra-low temperature sintering of Cu@Ag core-shell nanoparticle paste by ultrasonic in air for high-temperature power device packaging
- (2018) Hongjun Ji et al. ULTRASONICS SONOCHEMISTRY
- Design of Cu nanoaggregates composed of ultra-small Cu nanoparticles for Cu-Cu thermocompression bonding
- (2018) Junjie Li et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Effect of Sintering Conditions on the Mechanical Strength of Cu-Sintered Joints for High-Power Applications
- (2018) Jeong-Won Yoon et al. Materials
- Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size
- (2018) Chuantong Chen et al. MATERIALS & DESIGN
- Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere
- (2018) Yue Gao et al. MATERIALS & DESIGN
- Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications
- (2018) Hongqiang Zhang et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air
- (2018) Zheng Zhang et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Enhancing Low-Temperature and Pressureless Sintering of Micron Silver Paste Based on an Ether-Type Solvent
- (2017) Hao Zhang, Wanli Li, Yue Gao, Hao Zhang, Jinting Jiu et al. JOURNAL OF ELECTRONIC MATERIALS
- Die Bonding Performance Using Bimodal Cu Particle Paste Under Different Sintering Atmospheres
- (2017) Yue Gao et al. JOURNAL OF ELECTRONIC MATERIALS
- Thermal Stability of Silver Paste Sintering on Coated Copper and Aluminum Substrates
- (2017) Chun Pei et al. JOURNAL OF ELECTRONIC MATERIALS
- Thermal stability of low-temperature sintered joint using Sn-coated Cu particles during isothermal aging at 250 °C
- (2017) Xiangdong Liu et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Effect of different sizes of Cu nanoparticles on the shear strength of Cu-Cu joints
- (2017) Yang Zuo et al. MATERIALS LETTERS
- Development of Cu-Ag pastes for high temperature sustainable bonding
- (2017) Ching-Huan Hsiao et al. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- Review of silver nanoparticle based die attach materials for high power/temperature applications
- (2017) Seyed Amir Paknejad et al. MICROELECTRONICS RELIABILITY
- Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications
- (2017) Byung-Suk Lee et al. MICROELECTRONICS RELIABILITY
- Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions
- (2017) Yingqiong Yong et al. Scientific Reports
- Antioxidation Properties and Surface Interactions of Polyvinylpyrrolidone-Capped Zerovalent Copper Nanoparticles Synthesized in Supercritical Water
- (2016) Takuya Morioka et al. ACS Applied Materials & Interfaces
- Highly Conductive Cu–Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles
- (2016) Jingdong Liu et al. ACS Applied Materials & Interfaces
- Enhanced copper micro/nano-particle mixed paste sintered at low temperature for 3D interconnects
- (2016) Y. Y. Dai et al. APPLIED PHYSICS LETTERS
- Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300 °C
- (2016) S.T. Chua et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Microstructure and Joint Properties of Nano-Silver Paste by Ultrasonic-Assisted Pressureless Sintering
- (2016) Yuan Li et al. JOURNAL OF ELECTRONIC MATERIALS
- Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design
- (2016) Chuantong Chen et al. JOURNAL OF ELECTRONIC MATERIALS
- Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study
- (2016) K. S. Siow et al. JOURNAL OF ELECTRONIC PACKAGING
- Pressureless sintering bonding using hybrid microscale Cu particle paste on ENIG, pure Cu and pre-oxidized Cu substrate by an oxidation–reduction process
- (2016) Xiangdong Liu et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Novel interface material used in high power electronic die-attaching on bare Cu substrates
- (2016) Su-Yan Zhao et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Sintering Bonding Process with Ag Nanoparticle Paste and Joint Properties in High Temperature Environment
- (2016) Jianfeng Yan et al. Journal of Nanomaterials
- Surface effect induced Cu-Cu bonding by Cu nanosolder paste
- (2016) J.J. Li et al. MATERIALS LETTERS
- Degradation of a sintered Cu nanoparticle layer studied by synchrotron radiation computed laminography
- (2016) Masanori Usui et al. MICROELECTRONICS RELIABILITY
- Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging
- (2016) Xiangdong Liu et al. SCRIPTA MATERIALIA
- The Influence of Pore Size on the Indentation Behavior of Metallic Nanoporous Materials: A Molecular Dynamics Study
- (2016) Daniel Esqué-de los Ojos et al. Materials
- Bimodal Sintered Silver Nanoparticle Paste with Ultrahigh Thermal Conductivity and Shear Strength for High Temperature Thermal Interface Material Applications
- (2015) Mingyu Li et al. ACS Applied Materials & Interfaces
- Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications
- (2015) Peng Peng et al. ACS Applied Materials & Interfaces
- Influence of nanoparticles content in silver paste on mechanical and electrical properties of LTJT joints
- (2015) Konrad Kiełbasiński et al. ADVANCED POWDER TECHNOLOGY
- Electrical conductivity of porous silver made from sintered nanoparticles
- (2015) Abu Samah Zuruzi et al. Electronic Materials Letters
- Parametric Study on Pressureless Sintering of Nanosilver Paste to Bond Large-Area (≥100 mm2) Power Chips at Low Temperatures for Electronic Packaging
- (2015) Shancan Fu et al. JOURNAL OF ELECTRONIC MATERIALS
- New Bonding Technique Using Copper Oxide Materials
- (2015) Toshiaki Morita et al. MATERIALS TRANSACTIONS
- Joining of Pure Copper Using Cu Nanoparticles Derived from CuO Paste
- (2015) Tomoyuki Fujimoto et al. MATERIALS TRANSACTIONS
- Thermal simulation of joints with high thermal conductivities for power electronic devices
- (2015) T. Ishizaki et al. MICROELECTRONICS RELIABILITY
- Microstructure evolution during 300 °C storage of sintered Ag nanoparticles on Ag and Au substrates
- (2014) S.A. Paknejad et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Pressure-Free Bonding of Metallic Plates with Ni Affinity Layers Using Cu Nanoparticles
- (2014) Toshitaka Ishizaki et al. JOURNAL OF ELECTRONIC MATERIALS
- Pressureless Bonding by Use of Cu and Sn Mixed Nanoparticles
- (2014) Toshitaka Ishizaki et al. JOURNAL OF ELECTRONIC MATERIALS
- Nanocopper Based Solder-Free Electronic Assembly
- (2014) K. Schnabl et al. JOURNAL OF ELECTRONIC MATERIALS
- Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?
- (2014) Kim S. Siow JOURNAL OF ELECTRONIC MATERIALS
- Synthesis of copper nanoparticles : An overview of the various methods
- (2014) Bahareh Khodashenas et al. KOREAN JOURNAL OF CHEMICAL ENGINEERING
- Mechanical properties of sintered Ag–Cu die-attach nanopaste for application on SiC device
- (2014) Kim Seah Tan et al. MATERIALS & DESIGN
- Spark Plasma Sintering constrained process parameters of sintered silver paste for connection in power electronic modules: Microstructure, mechanical and thermal properties
- (2014) N. Alayli et al. MATERIALS CHEMISTRY AND PHYSICS
- Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging
- (2014) Shancan Fu et al. MATERIALS LETTERS
- Reliability of Cu nanoparticle joint for high temperature power electronics
- (2014) T. Ishizaki et al. MICROELECTRONICS RELIABILITY
- A metal–metal bonding process using metallic copper nanoparticles produced by reduction of copper oxide nanoparticles
- (2014) Yoshio Kobayashi et al. Journal of Materials Research and Technology-JMR&T
- Thermal stability of Cu@Ag core–shell nanoparticles
- (2013) Chi-Hang Tsai et al. CORROSION SCIENCE
- X-ray photoelectron spectroscopic study of the formation of Cu/Ni interface mediated by oxide phase
- (2013) Toshikazu Satoh et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Simplification of Low-Temperature Sintering Nanosilver for Power Electronics Packaging
- (2013) Yunhui Mei et al. JOURNAL OF ELECTRONIC MATERIALS
- Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste
- (2013) Tomohiro Yamakawa et al. JOURNAL OF ELECTRONIC MATERIALS
- Metal–Metal Bonding Process Using Cu+Ag Mixed Nanoparticles
- (2013) Jianfeng Yan et al. MATERIALS TRANSACTIONS
- Migration issues in sintered-silver die attaches operating at high temperature
- (2013) R. Riva et al. MICROELECTRONICS RELIABILITY
- Thermal characterizations of Cu nanoparticle joints for power semiconductor devices
- (2013) T. Ishizaki et al. MICROELECTRONICS RELIABILITY
- Microstructure of metallic copper nanoparticles/metallic disc interface in metal-metal bonding using them
- (2013) Yoshio Kobayashi et al. SURFACE AND INTERFACE ANALYSIS
- Polymer-Protected Cu-Ag Mixed NPs for Low-Temperature Bonding Application
- (2012) Jianfeng Yan et al. JOURNAL OF ELECTRONIC MATERIALS
- A new one-pot method for the synthesis of Cu nanoparticles for low temperature bonding
- (2012) Toshitaka Ishizaki et al. JOURNAL OF MATERIALS CHEMISTRY
- Microstructural stability of Ag sinter joining in thermal cycling
- (2012) Soichi Sakamoto et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Ag Dewetting in Cu@Ag Monodisperse Core–Shell Nanoparticles
- (2012) Anya Muzikansky et al. Journal of Physical Chemistry C
- Metal–metal bonding process using metallic copper nanoparticles prepared in aqueous solution
- (2011) Y. Kobayashi et al. INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
- Mechanical properties of nano-silver joints as die attach materials
- (2011) Kim S. Siow JOURNAL OF ALLOYS AND COMPOUNDS
- A Low-Temperature Pressureless Bonding Process Using a Trimodal Mixture System of Ag Nanoparticles
- (2011) Y. Morisada et al. JOURNAL OF ELECTRONIC MATERIALS
- Preparation of PVP coated Cu NPs and the application for low-temperature bonding
- (2011) Yan Jianfeng et al. JOURNAL OF MATERIALS CHEMISTRY
- Electrochemical migration behaviour of Cu, Sn, Ag and Sn63/Pb37
- (2011) Bálint Medgyes et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
- Oxidation behavior of copper nanoparticles at low temperature
- (2011) Akihiro Yabuki et al. MATERIALS RESEARCH BULLETIN
- Enhancements of thermal conductivities with Cu, CuO, and carbon nanotube nanofluids and application of MWNT/water nanofluid on a water chiller system
- (2011) MinSheng Liu et al. Nanoscale Research Letters
- A Low-Temperature Bonding Process Using Mixed Cu–Ag Nanoparticles
- (2010) Y. Morisada et al. JOURNAL OF ELECTRONIC MATERIALS
- Swelling of Copper Powders during Sintering of Heat Pipes in Hydrogen-Containing Atmospheres
- (2010) Yueh-Ju Lin et al. MATERIALS TRANSACTIONS
- Preparation of metallic copper nanoparticles in aqueous solution and their bonding properties
- (2010) Y. Kobayashi et al. SOLID STATE SCIENCES
- Copper Nanoparticles for Printed Electronics: Routes Towards Achieving Oxidation Stability
- (2010) Shlomo Magdassi et al. Materials
- Optimal design of coating material for nanoparticles and its application for low-temperature interconnection
- (2009) Motoi Tobita et al. JOURNAL OF NANOPARTICLE RESEARCH
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