Transient liquid phase bonding of Sn–Bi solder with added Cu particles

A review: On the development of low melting temperature Pb-free solders

(2014) Hiren R. Kotadia et al.   MICROELECTRONICS RELIABILITY

Thermal Stability Characterization of the Au–Sn Bonding for High-Temperature Applications

(2013) Rogie I. Rodriguez et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Phase-field simulations of intermetallic compound growth in Cu/Sn/Cu sandwich structure under transient liquid phase bonding conditions

(2012) M.S. Park et al.   ACTA MATERIALIA

Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction

(2012) H. R. Kotadia et al.   JOURNAL OF APPLIED PHYSICS

Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile

(2012) Tong Hong Wang et al.   MICROELECTRONICS RELIABILITY

Overview of transient liquid phase and partial transient liquid phase bonding

(2011) Grant O. Cook et al.   JOURNAL OF MATERIALS SCIENCE

Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process

(2010) J.F. Li et al.   ACTA MATERIALIA

Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

(2010) J.F. Li et al.   ACTA MATERIALIA

Improving tensile and fatigue properties of Sn–58Bi/Cu solder joints through alloying substrate

(2010) QingKe Zhang et al.   JOURNAL OF MATERIALS RESEARCH

The Effects of the Soldering Process on Whisker Growth on Solder Alloys under the Conditions of High Temperature and High Humidity

(2010) Takashi Nozu et al.   JOURNAL OF THE JAPAN INSTITUTE OF METALS

Investigation of delamination control in plastic package

(2009) Shufeng Zhao et al.   MICROELECTRONICS RELIABILITY