Investigation of Cu-Sn-Cu transient liquid phase bonding for microsystems packaging

A novel approach to dissimilar joining of AA7075 to AZ31B by friction stir soldering using Sn intermediate layer

(2022) Omid Karimi-Dermani et al.   MATERIALS AND MANUFACTURING PROCESSES

Development of 3-D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology

(2022) Zuohuan Chen et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Glass Frit Jetting for Advanced Wafer-Level Hermetic Packaging

(2022) Ali Roshanghias et al.   Materials

A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging

(2021) Harindra Kumar Kannojia et al.   Journal of Materials Science: Materials in Electronics

Effect of tool-electrode material in through-hole formation using ECDM process

(2021) Julfekar Arab et al.   MATERIALS AND MANUFACTURING PROCESSES

Through-holes micromachining of alumina using a combined pulse-feed approach in ECDM

(2021) Priyaranjan Sharma et al.   MATERIALS AND MANUFACTURING PROCESSES

Hermetic chip-scale packaging using Au:Sn eutectic bonding for implantable devices

(2021) Katarzyna M Szostak et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Silicon MEMS inertial sensors evolution over a quarter century

(2021) G Langfelder et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Surface modification of Cu electroplated layers for Cu–Sn transient liquid phase bonding

(2021) Shao-Yu Hsu et al.   MATERIALS CHEMISTRY AND PHYSICS

Demonstrating 170 °C Low-Temperature Cu–In–Sn Wafer-Level Solid Liquid Interdiffusion Bonding

(2021) Vesa Vuorinen et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Wafer Level Solid Liquid Interdiffusion Bonding: Formation and Evolution of Microstructures

(2020) V. Vuorinen et al.   JOURNAL OF ELECTRONIC MATERIALS

Piezoelectric MEMS Resonators: A Review

(2020) Gayathri Pillai et al.   IEEE SENSORS JOURNAL

Microstructure evolution and grain orientation of IMC in Cu-Sn TLP bonding solder joints

(2019) Lei Sun et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Fabrication of multiple through-holes in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging

(2019) Julfekar Arab et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Effect of surface roughness on void formation and intermetallic growth in electrodeposited Cu-Sn stacks

(2019) Harindra Kumar Kannojia et al.   MATERIALS LETTERS

Void Formation and Intermetallic Growth in Pulse Electrodeposited Cu-Sn Layers for MEMS Packaging

(2018) Harindra Kumar Kannojia et al.   JOURNAL OF ELECTRONIC MATERIALS

Shear strength and fracture mechanism for full Cu-Sn IMCs solder joints with different Cu3Sn proportion and joints with conventional interfacial structure in electronic packaging

(2018) Peng Yao et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Effect of heating rate on porous TiAl-based intermetallics synthesized by thermal explosion

(2016) Xinyang Jiao et al.   MATERIALS AND MANUFACTURING PROCESSES

Dissolution of Copper and Formation of IMC in Bulk Lead-Free Solders

(2014) Mohammad Faizan   MATERIALS AND MANUFACTURING PROCESSES

Effects of surface treatment on the bonding quality of wafer-level Cu-to-Cu thermo-compression bonding for 3D integration

(2013) J Fan et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Diffusion Bonding Between Zircaloy-4 and 304L Stainless Steel in the Presence of a Eutectic

(2013) M. Taouinet et al.   MATERIALS AND MANUFACTURING PROCESSES

Wafer bonding using Cu–Sn intermetallic bonding layers

(2013) C. Flötgen et al.   MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS

Intermetallic Compound Formation Mechanisms for Cu-Sn Solid–Liquid Interdiffusion Bonding

(2012) H. Liu et al.   JOURNAL OF ELECTRONIC MATERIALS

On the Direct Diffusion Bonding of Titanium Alloy to Stainless Steel

(2010) Swarup K. Ghosh et al.   MATERIALS AND MANUFACTURING PROCESSES