Effect of Process and Service Conditions on TLP-Bonded Components with (Ag,Ni–)Sn Interlayer Combinations

Title
Effect of Process and Service Conditions on TLP-Bonded Components with (Ag,Ni–)Sn Interlayer Combinations
Authors
Keywords
TLP bonding, microstructure, defect formation, shear strength, annealing
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 44, Issue 11, Pages 4576-4588
Publisher
Springer Nature
Online
2015-08-28
DOI
10.1007/s11664-015-3982-3

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