Improvement on the mechanical properties of eutectic Sn58Bi alloy with porous Cu addition during isothermal aging

Interfacial microstructure evolution and properties of Sn-0.3Ag-0.7Cu–xSiC solder joints

(2021) Limeng Yin et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs

(2021) Chongyang Cai et al.   MICROELECTRONICS RELIABILITY

Microstructure, mechanical, and thermal behaviors of SnBi/Cu solder joint enhanced by porous Cu

(2020) Yang Liu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints

(2020) Haozhong Wang et al.   MATERIALS CHARACTERIZATION

Evolution of microstructure and effects on crack formation of Sn3.0Ag0.5Cu/Cu solder joints under accelerated thermal cycling

(2019) Linmei Yang et al.   Materials Research Express

Effect of substrates on the formation of Kirkendall voids in Sn/Cu joints

(2019) Jieshi Chen et al.   Welding in the World

Effect of Cu concentration on the interfacial reactions between Sn-xCu solders and Cu substrate

(2019) Nifa Bao et al.   Materials Research Express

Improved microstructure and mechanical properties for SnBi solder alloy by addition of Cr powders

(2019) Wenbo Zhu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of CuZnAl particles addition on microstructure of Cu/Sn58Bi/Cu TLP bonding solder joints

(2019) Mingyue Xiong et al.   VACUUM

Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal aging

(2018) Shiqi Zhou et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction

(2018) F.Q. Hu et al.   MATERIALS LETTERS

Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy

(2018) Shiqi Zhou et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Microstructure, hardness, and shear behavior of the as-soldered SnBi–SAC composite solder pastes

(2017) Yang Liu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Recommended values for the βSn solidus line in Sn-Bi alloys

(2017) S.A. Belyakov et al.   THERMOCHIMICA ACTA

Correlation between microstructure and mechanical properties of Sn–Bi–X solders

(2016) Omid Mokhtari et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Physical properties of Sn58Bi–xNi lead-free solder and its interfacial reaction with copper substrate

(2015) Kannachai Kanlayasiri et al.   MATERIALS & DESIGN

Inhibiting the growth of Cu3Sn and Kirkendall voids in the Cu/Sn-Ag-Cu system by minor Pd alloying

(2012) Cheng En Ho et al.   Electronic Materials Letters

Transition of Bi embrittlement of SnBi/Cu joint couples with reflow temperature

(2011) H.F. Zou et al.   JOURNAL OF MATERIALS RESEARCH