Extremely thin interlayer of multi-element intermetallic compound between Sn-based solders and FeCoNiMn high-entropy alloy

Investigation of FeCoNiCu properties: thermal stability, corrosion behavior, wettability with Sn-3.0Ag-0.5Cu and interlayer formation of multi-element intermetallic compound

(2021) Yu-An Shen et al.   APPLIED SURFACE SCIENCE

New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints

(2020) Peng Zhang et al.   MATERIALS & DESIGN

Thermomigration induced microstructure and property changes in Sn-58Bi solders

(2019) Yu-An Shen et al.   MATERIALS & DESIGN

Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging

(2019) Yu-An Shen et al.   Scientific Reports

Lattice distortion effect on elastic anisotropy of high entropy alloys

(2019) Chao-Chun Yen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Novel polarity effect on intermetallic compound thickness changes during electromigration in Cu/Sn-3.0Ag-0.5Cu/Cu solder joints

(2019) Zhi Jin et al.   JOURNAL OF APPLIED PHYSICS

Effect of isothermal aging on the microstructure, shear behavior and hardness of the Sn58Bi/Sn3.0Ag0.5Cu/Cu solder joints

(2019) Ruisheng Xu et al.   Results in Physics

Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology

(2019) Yu-An Shen et al.   MATERIALS & DESIGN

Studies of “sluggish diffusion” effect in Co-Cr-Fe-Mn-Ni, Co-Cr-Fe-Ni and Co-Fe-Mn-Ni high entropy alloys; determination of tracer diffusivities by combinatorial approach

(2018) Witold Kucza et al.   JOURNAL OF ALLOYS AND COMPOUNDS

High entropy alloy FeCoNiCu matrix composites reinforced with in-situ TiC particles and graphite whiskers

(2018) Xiaodong Sun et al.   MATERIALS CHEMISTRY AND PHYSICS

Effect of Ti on microstructures and mechanical properties of high entropy alloys based on CoFeMnNi system

(2018) Peng Cui et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Enhanced strength and ductility in a high-entropy alloy via ordered oxygen complexes

(2018) Zhifeng Lei et al.   NATURE

Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps

(2018) Yu-An Shen et al.   MATERIALS LETTERS

Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn addition

(2017) Y. Zhong et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Intermetallic compounds in 3D integrated circuits technology: a brief review

(2017) Syahira Annuar et al.   SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS

Effect of Sn grain orientation on formation of Cu 6 Sn 5 intermetallic compounds during electromigration

(2017) Yu-An Shen et al.   SCRIPTA MATERIALIA

Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling

(2016) Yuan-Wei Chang et al.   ACTA MATERIALIA

Dissolution and precipitation kinetics of Cu 6 Sn 5 intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient

(2016) N. Zhao et al.   INTERMETALLICS

Exceptional resistance to grain growth in nanocrystalline CoCrFeNi high entropy alloy at high homologous temperatures

(2016) S. Praveen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

First-principles calculation of Mg/MgO interfacial free energies

(2015) Wenwu Xu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Asymmetrical Precipitation of Ag3Sn Intermetallic Compounds Induced by Thermomigration of Ag in Pb-Free Microbumps During Solid-State Aging

(2015) Yu-Ping Su et al.   JOURNAL OF ELECTRONIC MATERIALS

Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes

(2015) Woo-Ram Myung et al.   JOURNAL OF ELECTRONIC MATERIALS

Materials challenges in three-dimensional integrated circuits

(2015) Kuan-Neng Chen et al.   MRS BULLETIN

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

(2015) Ai Ting Tan et al.   SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS

High-Entropy Alloys: A Critical Review

(2014) Ming-Hung Tsai et al.   Materials Research Letters

Sluggish diffusion in Co–Cr–Fe–Mn–Ni high-entropy alloys

(2013) K.-Y. Tsai et al.   ACTA MATERIALIA

Atomic Structure Modeling of Multi-Principal-Element Alloys by the Principle of Maximum Entropy

(2013) Shaoqing Wang   Entropy

Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder

(2013) Y. Tang et al.   MATERIALS & DESIGN

Surface finish effect on reliability of SAC 305 soldered chip resistors

(2013) Maurice N. Collins et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Concurrent nucleation, formation and growth of two intermetallic compounds (Cu6Sn5 and Cu3Sn) during the early stages of lead-free soldering

(2011) M.S. Park et al.   ACTA MATERIALIA

Reliability challenges in 3D IC packaging technology

(2010) K.N. Tu   MICROELECTRONICS RELIABILITY

Equilibrium phase of high-entropy FeCoNiCrCu0.5 alloy at elevated temperature

(2009) Chun-Ming Lin et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Interfacial intermetallic growth and shear strength of lead-free composite solder joints

(2008) S.M.L. Nai et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Diffusion barrier properties of AlMoNbSiTaTiVZr high-entropy alloy layer between copper and silicon

(2007) Ming-Hung Tsai et al.   THIN SOLID FILMS