Low-Temperature Co-hydroxylated Cu/SiO2 Hybrid Bonding Strategy for a Memory-Centric Chip Architecture

Negative Photoconductance Effect: An Extension Function of the TiO x ‐Based Memristor

(2021) Guangdong Zhou et al.   Advanced Science

Refining the Negative Differential Resistance Effect in a TiOx-Based Memristor

(2021) Xiaofang Hu et al.   Journal of Physical Chemistry Letters

Two-dimensional materials for next-generation computing technologies

(2020) Chunsen Liu et al.   Nature Nanotechnology

Surface coordination layer passivates oxidation of copper

(2020) Jian Peng et al.   NATURE

Direct bonding of silicon and quartz glass using VUV/O 3 activation and a multistep low-temperature annealing process

(2018) Jikai Xu et al.   APPLIED SURFACE SCIENCE

Low temperature de-oxidation for copper surface by catalyzed formic acid vapor

(2018) Pei-Wen Chou et al.   APPLIED SURFACE SCIENCE

Nitrogen passivation formation on Cu surface by Ar–N2 plasma for Cu-to-Cu wafer stacking application

(2018) Haesung Park et al.   MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS

Three-dimensional integration of nanotechnologies for computing and data storage on a single chip

(2017) Max M. Shulaker et al.   NATURE

FTIR and Raman Characterization of TiO2 Nanoparticles Coated with Polyethylene Glycol as Carrier for 2-Methoxyestradiol

(2017) Andrea León et al.   Applied Sciences-Basel

Combined surface-activated bonding technique for low-temperature hydrophilic direct wafer bonding

(2016) Ran He et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Combined Surface Activated Bonding Technique for Low-Temperature Cu/Dielectric Hybrid Bonding

(2016) Ran He et al.   ECS Journal of Solid State Science and Technology

Argon plasma treatment on Cu surface for Cu bonding in 3D integration and their characteristics

(2015) Manseok Park et al.   APPLIED SURFACE SCIENCE

Time-varying wetting behavior on copper wafer treated by wet-etching

(2015) Sheng-Hung Tu et al.   APPLIED SURFACE SCIENCE

Cu/Cu direct bonding by metal salt generation bonding technique with organic acid and persistence of reformed layer

(2015) Shinji Koyama et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu

(2015) Chien-Min Liu et al.   Scientific Reports

Propanoate grafting on (H,OH)-Si(0 0 1)-2 × 1

(2014) Fabrice Bournel et al.   JOURNAL OF PHYSICS-CONDENSED MATTER

Effects of surface treatment on the bonding quality of wafer-level Cu-to-Cu thermo-compression bonding for 3D integration

(2013) J Fan et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Electronic Structures of Formic Acid (HCOOH) and Formate (HCOO–) in Aqueous Solutions

(2012) Matthew A. Brown et al.   Journal of Physical Chemistry Letters

Low temperature bonding technology for 3D integration

(2011) Cheng-Ta Ko et al.   MICROELECTRONICS RELIABILITY

Room-Temperature Charge Stability Modulated by Quantum Effects in a Nanoscale Silicon Island

(2011) S. J. Shin et al.   NANO LETTERS

Cu–Cu diffusion bonding enhancement at low temperature by surface passivation using self-assembled monolayer of alkane-thiol

(2009) C. S. Tan et al.   APPLIED PHYSICS LETTERS

Low-Temperature, Strong SiO2-SiO2 Covalent Wafer Bonding for III–V Compound Semiconductors-to-Silicon Photonic Integrated Circuits

(2008) Di Liang et al.   JOURNAL OF ELECTRONIC MATERIALS