Interfacial reaction and mechanical properties for Cu/Sn/Ag system low temperature transient liquid phase bonding
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Title
Interfacial reaction and mechanical properties for Cu/Sn/Ag system low temperature transient liquid phase bonding
Authors
Keywords
IMCs Layer, Interfacial Microstructure, Bonding Time, Cu3Sn Phase, Energy Disperse Spectroscope
Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 27, Issue 5, Pages 4839-4848
Publisher
Springer Nature
Online
2016-01-27
DOI
10.1007/s10854-016-4366-z
References
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