Effect of cobalt nanoparticles on mechanical properties of Sn–58Bi solder joint
Published 2022 View Full Article
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Title
Effect of cobalt nanoparticles on mechanical properties of Sn–58Bi solder joint
Authors
Keywords
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Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 33, Issue 28, Pages 22573-22579
Publisher
Springer Science and Business Media LLC
Online
2022-09-21
DOI
10.1007/s10854-022-09035-6
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- Influence of BaTiO3 Nanoparticle Addition on Microstructure and Mechanical Properties of Sn-58Bi Solder
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- Effects of minor Cu and Zn additions on the thermal, microstructure and tensile properties of Sn–Bi-based solder alloys
- (2014) Jun Shen et al. JOURNAL OF ALLOYS AND COMPOUNDS
- A review: On the development of low melting temperature Pb-free solders
- (2014) Hiren R. Kotadia et al. MICROELECTRONICS RELIABILITY
- Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder Joints
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- Effects of multiple reflows on intermetallic morphology and shear strength of SnAgCu–xNi composite solder joints on electrolytic Ni/Au metallized substrate
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